As a professional Manufacturer, Supplier and Exporter with a factory in Taiwan, our main products include all kinds of SMT Process products. We constantly upgrade our products as per the technological changes and requirements in the fast flourishing industry. It is our force to manufacture with the best quality and the most competitive price. If you are interested in any styles of our products, please feel free to contact us.
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See Operation Vedio
SMT P-1 : Surface Mount Assembly
Surface Mount Technology ( SMT ) is a method of pcb assembly that involves soldering tabs of metal directly to printed circuit boards(PCB). This technology allows printed circuit boards to be more compact and has become the industry-favored method for printed circuit board assembly. The efficiency and affordability of our automated Surface Mount Technology(SMT) allows us to pass significant savings on to our customers. Our state-of-the-art facility ensures the accuracy and quality that gives their products the competitive edge.
Processing Capacity
* SMT Lead-free Process.
* All products go through Auto Optical Inspection (AOI) for Quality Inspection.
* Mount capacity up to 1,200,000pcs of chip resistors or capacitors daily.
* DIP capacity up to 70,000pcs of components daily.
* Mountable minimum chip resistor or capacitor is 0201(Metric)
* The best applicable IC pitch is 0.3 mm.
* The smallest applicable ball diameter and pitch of BGA are 0.25mm and 0.4mm.
* Maximum applicable PCB size is between 410mm x 360mm~50mm x30mm
* Processes include: dispense glue, print glue, solder paste print, both glue and solder
paste,single-side, double-side boards and Flexible Print Circuit (FPC) boards assembly.
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See Operation Vedio
SMT P-2 : Surface Mount Technology
Surface Mount Technology ( SMT ) is a method of pcb assembly that involves soldering tabs of metal directly to printed circuit boards(PCB). This technology allows printed circuit boards to be more compact and has become the industry-favored method for printed circuit board assembly. The efficiency and affordability of our automated Surface Mount Technology(SMT) allows us to pass significant savings on to our customers. Our state-of-the-art facility ensures the accuracy and quality that gives their products the competitive edge.
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See Operation Vedio
SMT P-3 : Assembly SMT
Product Name: SMT AQI Quality Inspection
Processing Capacity
★SMT Lead-free Process.
★All products go through Auto Optical Inspection (AOI) for Quality Inspection.
★Mount capacity up to 1,200,000pcs of chip resistors or capacitors daily.
★DIP capacity up to 70,000pcs of components daily.
★Mountable minimum chip resistor or capacitor is 0201(Metric)
★The best applicable IC pitch is 0.3 mm.
★The smallest applicable ball diameter and pitch of BGA are 0.25mm and 0.4mm.
★Maximum applicable PCB size is between 410mm x 360mm~50mm x30mm
★Processes include: dispense glue, print glue, solder paste print, both glue and solder paste,single-side, double-side boards and Flexible Print Circuit (FPC) boards assembly.
Model: SMT P-3
More details please contact us, thank you!
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SMT P-4 : SMT TechnologySMT Required Information
* GERBER
Provide with PCB maker
a.A standard PCB circuit file
b.Reminder(See Picture)
1. Standard border specifications: 10mm margin to top and bottom
2. Standard location hole: Two location holes on top border left and right side,4mm diameter hole at 5mm from hole center to each edge.
3. Fiducial mark: two marks,one located at corner of one border with a 1mm solid solder round point and the 3mm-diameter transparent ring on the outer loop.The other mark located at another border but opposite corner and asymmetric position to the first.
* BOM Sheet:
Reminer: a.Combined SMT components (top and bottom side) and DIP components in one BOM sheet.
b.Or in two separate BOM sheets:includes SMT components (top side and bottom side) and DIP components.
c. Or top side components, SMT bottom side components, and DIP components in three sheets.
* Coordinates file: CAD as in TXT file.
* Auxiliary data
* Discard board for profile testing
* Sample Board
* Empty PCB
* Stencil
* Other Notes
All the staff will serve the old and new customers with best
The process that assembles these micro components to print board (or other substrate) is known as the SMT Process. Surface Mount Technology (referred to as SMT) is a new generation of electronic assembly technology, it will compress the traditional electronic components into the minimal size of components, in order to make the electronic assembly products achieve high-density, high reliability, small, low cost, and production automation. Miniaturization of components such as: SMY device (also known as SMC, chip devices). And related assembly equipment is referred to as SMT equipment. Surface mount technology is the preferred technology in electronics manufacturing because it is cost effective in comparison with other techniques, such as through-hole processes. With good high frequency characteristics, it has many advantages like assembly of high density, electronic products, small size, and light weight. Currently, the advanced electronic products, especially in computer and communications electronics products, are widely utilizing SMT Process. It is the most popular form of technology and processes in electronics assembly industry. Surface mount technology, these new standard allowed electronic components to be mounted directly onto printed circuit boards either by hand or with automated equipment. It can reduce electromagnetic and RF interference. This process can easy to automate and improve production efficiency, reduce costs by 30% to 50%. It can save materials, energy, equipment, manpower and time. High reliability, strong anti-vibration, solder joint defect rate. Our products are used worldwide and are approved for use at many end users and engineering companies. Due to use of cost efficient technology in our assembly unit, we can supply our complete range to the customers at market leading prices.
SMT Process
and the best service. Both new and old customers at home and abroad are welcome to visit our company!The process that assembles these micro components to print board (or other substrate) is known as the SMT Process. Surface Mount Technology (referred to as SMT) is a new generation of electronic assembly technology, it will compress the traditional electronic components into the minimal size of components, in order to make the electronic assembly products achieve high-density, high reliability, small, low cost, and production automation. Miniaturization of components such as: SMY device (also known as SMC, chip devices). And related assembly equipment is referred to as SMT equipment. Surface mount technology is the preferred technology in electronics manufacturing because it is cost effective in comparison with other techniques, such as through-hole processes. With good high frequency characteristics, it has many advantages like assembly of high density, electronic products, small size, and light weight. Currently, the advanced electronic products, especially in computer and communications electronics products, are widely utilizing SMT Process. It is the most popular form of technology and processes in electronics assembly industry. Surface mount technology, these new standard allowed electronic components to be mounted directly onto printed circuit boards either by hand or with automated equipment. It can reduce electromagnetic and RF interference. This process can easy to automate and improve production efficiency, reduce costs by 30% to 50%. It can save materials, energy, equipment, manpower and time. High reliability, strong anti-vibration, solder joint defect rate. Our products are used worldwide and are approved for use at many end users and engineering companies. Due to use of cost efficient technology in our assembly unit, we can supply our complete range to the customers at market leading prices.
